MTS Smart Wafer Saw/ Dicing Solutions

Wafer Sawing/ Dicing is one of the major process step in semiconductor manufacturing and lots of effort are being spend to improve both quality and throughput but were all unsuccessful. MTS Diagnosis Technology and Domain AI knowledge have long time resolved this Major Challenges in Sawing/ Dicing - Higher Throughput and Higher Quality better than baseline (As Is/ POR) . 0 PPM Quality issues resolved through MTS Solution like Top metal peeling, Topside chipping, Sidewall cracks, Backside chipping, Wavy cut, Fly die, Broken Blade and more. Zero Alarm Issue like Kerf check & Edge align, NCS alarms and others.

MTS Wafer Saw Cutting Speed/ UPH Solution – UPH Solution, improve > 50%

WAFER SAW shows a lot of opportunities for improvements, from MTBA –Alarms like Kerf Check, MTBF -Machine down, Blade Setup, Auto dressing, Spinner Wash/ Dry.

MTS Solution; Focus “Time is money” .

1. MTBF – MTS Zero Jam/ Zero Downtime Solution – MTBF 24Hr./day
2. MTBA – MTS Zero Alarm Solution
3. UPH - MTS UPH Solution (50% Increase)
4. Cutting Speed = Feed speed up to 140mm/s
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