Die Bond

MTS Die Attach UPH Solution – UPH Solution, improve > 200%

DIE BOND/ Die Attach shows a lot of opportunities for improvements, from MTBA -Alarms, MTBF -Machine down, Setup time, Un-optimized Recipe & tooling.

MTS Solution; Focus “Time is money”

  1. MTBF – MTS Zero Jam/ Zero Downtime Solution – MTBF 24Hr./day
  2. MTBA – MTS Zero Alarm Solution
  3. UPH - MTS UPH Solution (200% Increase) UPH 1900 using 4 Stacked Memory Die
  4. Precision Improvement ± < 15um