MTS Back Grinding / Polish Quality & WPH Solution – UPH Solution, improve > 50%

Back Grinding/ Lapping/ polish shows a lot of opportunities for improvements, from MTBA –Alarms like BG Tape peeling, MTBF -Machine down, MC Setup/ Calibration, Change Wheel, Un-optimize Recipe.

MTS Solution; Focus “Time is money”

1. MTBF – MTS Zero Jam/ Zero Downtime Solution – MTBF 24Hr./day
2. MTBA – MTS Zero Alarm Solution
3. WPH - MTS UPH Solution (50% Increase) with High Speed Peeling.
4. MTS Wafer Layout Crack Solution
5. MTS Wafer Warpage Solution
6. MTS ESD/ Circle Burn Mark Solution
7. MTS Grinding Wheel Life Extension
8. MTS Lapping to Polish Solution