MTS Semiconductor Industry Solution, MTS set out our Main goal in Smart Manufacturing towards Capacity Improvement, Cost Reduction, Capex Avoidance, Down time reduction, Quality & Yield improvements through MTS technology.

Co-work partnership Achievements:

• 5G FT OEE improvement from 76% to 93%, 1st Pass Yield from 80% to 97.6%.
• 5G Pkg Saw PnP UPH Improvement > 200%, from 2000 to 5000 units.
• Pkg Saw Cutting Speed improvement > 200%, from 50mm/s to 200mm/s.
• FO Back Grinding WPH improvement > 200%, from WPH 6.9 to WPH 16.4 wafers.
• FX Back Grinding WPH improvement > 50%, from WPH 16.4 to WPH 25 wafers.
• Driver IC Back Grinding Lapping to Polish capability improvement, Capex avoidance 6.75M USD (1.35M USD x 5units).
• Driver IC Wafer Saw Cutting Speed & Quality Improvement > 50%, from 10mm/s to 15mm/s (Chipping from 10,000 PPM to 100 PPM).
• FO/ FX Wafer Saw Cutting Speed Improvement 150%, from 100mm/s to 250mm/s.
• Bumped Wafer Saw Cutting Speed Improvement 50%, from 40mm/s to 60mm/s.
• 5G Device Bumped Wafer Saw Top Chipping from 250 PPM to Zero PPM / Back side Chipping from 1000 PPM to Zero PPM.
• Memory IC Pkg Saw Cutting Speed improvement > 100%, from 200mm/s to 450mm/s.
• Pick n place inspection UPH improvement + >40%, from 27K units/ hr. to 38.5K units/ hr.
• Die Bond precision from ± >50um to ± 15um, Capex avoidance XXX K USD.
• Wire Bond precision from ± >5um to ± <2um, Capex avoidance XXX K USD.
• Wire Bond UPH > 30%, WPS 6 wires to WPS 9 wires (Full Qual of product reliability testing PASSED) FC Molding throughput improvement > +30%, From 15 Shots to 19.6 Shots per day.
• Many more achievements from Assembly and Test Operations.