WB Package Process Solution

MTS Wirebond Process Solution – CAP & QAP Solution improve up to >100%

Wirebond team together with MTS team to identify improvement opportunities for some Key Process Stations to improve QUALITY, Throughput- UPH, MTBA –Alarms/ TS PPM , MTBF -Machine down, Recipe Optimization.

MTS Solution: Focus “Time is money”

  1. MTBF – MTS Zero Jam/ Zero Downtime Solution – All process equipment
  2. MTBA – MTS Zero Alarm Solution – All process equipment
  3. MTS BG WPH Improvement Solution
  4. MTS Wafer Cutting speed improvement Solution
  5. MTS Die Attach UPH Improvement Solution
  6. MTS Wirebond Improvement Solution
  7. MTS Molding Shots per day Improvement Solution
  8. MTS Pkg Singulation & PnP UPH Improvement Solution