Flip Chip Package Process Solution

MTS Flip Chip Process Solution – CAP & QAP Solution improve > 50%.

FLIP CHIP team together with MTS team to identify improvement opportunities for some Key Process Stations to improve QUALITY, Throughput, MTBA –Alarms.

MTS Solution; Focus “Time is money”

  1. MTBF – MTS Zero Jam/ Zero Downtime Solution
  2. MTBA – MTS Zero Alarm Solution
  3. MTS Strip Warpage Solution
  4. Molding shots per day
  5. Flip Chip Bond precision improvement
  6. Pkg Singulation Saw Cutting Speed + PnP UPH Solution