Bumping Package Process Solution

MTS Bumping Process Solution – CAP & QAP Solution improve up to >100%

Bumping team together with MTS team to identify improvement opportunities for some Key Process Stations to improve QUALITY, Throughput, MTBA –Alarms , MTBF -Machine down, MC Setup/ Calibration.

MTS Solution; Focus “Time is money”

  1. MTBF – MTS Zero Jam/ Zero Downtime Solution
  2. MTBA – MTS Zero Alarm Solution
  3. MTS Wafer Warpage Solution
  4. MTS Wafer Cutting speed improvement Solution
  5. MTS BG WPH Improvement Solution
  6. MTS PnP UPH Improvement Solution
  7. MTS Sputter Quality Improvement program solution
  8. MTS Platter Quality Improvement program solution
  9. MTS Oven Solution